In a recent published report, Kenneth Research has updated the market report for Flip Chip Technologies Market for 2021 till 2030. Report further now discusses; the various strategies to be adopted or being adopted by the business players across the globe at various levels in the value chain. In the view of the global economic slowdown, we further estimated that China, India, Japan and South Korea to recover fastest amongst all the countries in the Asian market. Germany, France, Italy, Spain to take the worst hit and this hit is expected to be regain 25% by the end of 2021- Positive Growth in the economic demand and supply.
U.S. Market recovers fast; In a release on May 4th 2021, the U.S. Bureau and Economic Analsysis and U.S. Census Bureau mentions the recovery in the U.S. International trade in March 2021. Exports in the country reached $200 billion, up by $12.4 billion in Feb 2021. Following the continuous incremental trend, imports tallied at $274.5 billion, picked up by $16.4 billion in Feb 2021. However, as COVID19 still haunts the economies across the globe, year-over-year (y-o-y) avergae exports in the U.S. declined by $7.0 billion from March 2020 till March 2021 whilest imports increased by $20.7 billion during the same time. This definitely shows how the market is trying to recover back and this will have a direct impact on the Healthcare/ICT/Chemical industries, creating a huge demand for Flip Chip Technologies Market products.
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According to a report by the World Health Organization (WHO), the total health spending is growing with an annual average rate of 6% in the low- and middle-income nations, and close to 4% in the high-income countries. Further, in the year 2016, the expenditure made on health reached close to 10% of the GDP of the world and crossed a value of USD 7 trillion.
“Final Report will add the analysis of the impact of COVID-19 on this industry.”
As per the latest report published by Variant Market Research, Global flip chip technologies market is estimated to reach $54 billion by 2024; growing at a CAGR of 9.3% from 2016 to 2024. Flip chip, a semiconductor interconnecting device is commonly used in many electronic products like PCs, smartphones, and medical devices, among others. Flip chip technology offers various benefits such as total package size reduction, reduction in the silicon cost, decrease in signal inductance, and high signal density. Flip chip technology is widely used in various industry verticals such as IT & telecommunication, automotive & transport, electronics, industrial, healthcare, and aerospace and defence, among others.
Major factors driving the global flip chip technologies market are advantages of flip chip technology than the traditional wire bond electrical connection, evolving internet of things, and rising demand for miniaturization & high-performing electronic devices. However, huge initial investment essential to set up new manufacturing plant may hamper the market growth. Furthermore, high acceptance of sensors in electronic devices would unfold with numerous growth opportunities in the forecasted year.
Major segments of the global flip chip technologies market are bumping technology, packaging type, packaging technology, industry vertical, and geography. Bumping technology comprises copper pillar, gold bumping, solder bumping (tin-lead eutectic solder, and lead-free solder), and other bumping technologies (aluminium & conductive polymer). By, packaging type, the market is categorized as flip chip PGA package, flip chip SiP package, flip chip BGA package, flip chip LGA package, and wafer level packaging-CSPnl. Furthermore, the market is sub segmented by packaging technology as 3D IC, 2.5D IC and 2D IC. Industry vertical is further divided into automotive & transport, electronics, industrial, healthcare, IT & telecommunication, aerospace and defence, and other industry verticals (renewable energy and media & entertainment).
Geographically, the global flip chip technologies market is categorized into North America, Europe, Asia-Pacific and RoW. The U.S., Mexico and Canada are covered under North America wherein Europe covers Germany, France, Italy, and Rest of Europe. Asia-Pacific covers China, Japan, South Korea, Taiwan, India, and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Middle East and Africa.
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The major players competing in the market are ASE group, Powertech Technology Inc., United Microelectronics Corporation, Intel Corporation, Siliconware Precision Industries Co., Ltd., Amkor Technology, Inc., TSMC, Jiangsu Changjiang Electronics Technology Co., Ltd., Samsung Electronics Co., and Texas Instruments, Inc., among others.
The key takeaways from the report:
The report will provide detailed analysis of Flip Chip Technologies Market with respect to major segments such as bumping technology, packaging type, packaging technology, and industry vertical
The report will include the qualitative and quantitative analysis with market estimation over 2015-2022 and compound annual growth rate (CAGR) between 2016 and 2022.
Comprehensive analysis of market dynamics including factors and opportunities.
An exhaustive regional analysis of Flip Chip Technologies Market.
Profile of key players of the Flip Chip Technologies Market, which include key financials, product & services and new developments.
Scope of Flip Chip Technologies Market
Bumping Technology Segments
Tin-lead eutectic solder
Other Bumping Technologies (Aluminium & Conductive polymer)
Packaging Type Segments
Flip Chip PGA Package
Flip Chip SiP Package
Flip Chip BGA Package
Flip Chip LGA Package
Wafer Level Packaging-CSPnl
Packaging Technology Segments
Industry Vertical Segments
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Automotive & Transport
IT & telecommunication
Aerospace and Defence
Other Industry Verticals (Renewable Energy and Media & Entertainment)
Rest of Europe
Rest of Asia-Pacific
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